Package Design Engineer

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.

Job Description

Package Design Engineer – location: Saint‑Egrève (near Grenoble, France) or Teledyne Anafocus in Seville (Spain). The role leads the complete design flow of advanced microelectronic packages, translating customer needs into technical specifications, defining the solution, and ensuring successful routing and design reviews.

Responsibilities

• Manage the full design flow of organic and ceramic multi‑layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP).
• Identify customers’ needs and devise a solution and specification.
• Interact with packaging manufacturers to obtain solutions and quotations throughout the design process.
• Coordinate with project teams (sensor designers, project managers, etc.).
• Implement the design and routing of the package in accordance with defined constraints and timing.
• Conduct electrical, thermal, and mechanical simulations when necessary.
• Perform DRC checks in accordance with e2v methodologies.
• Conduct various design reviews, including the final review before ordering the package.
• Serve as the design expert for assembly houses (assembly instructions, etc.).

Technical Interface

• Guide technical reviews with package vendors.
• Identify and evaluate new vendors.

Technology Monitoring

• Maintain a technology watch on future generations of imaging packages.
• Identify and lead R&D or continuous improvement projects on these technologies.

Why Join Us

A strong customer‑focused individual with active listening skills, team‑work ability, adaptability, and rigorous communication. Autonomy to plan for results and continuous improvement is essential for this position.

Qualifications

• Background in microelectronics, electronics (preferred), material science, or micromechanics.
• Confirmed experience in packaging design.
• Experience in imaging and/or assembly is a serious plus.
• Mastery of package design flow: specification, solution identification, design, and validation.
• Mastery of packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).
• Basic mechanical design knowledge (SolidWorks or equivalent).
• Experience in technical management of package vendors and assembly houses.

Additional Advantages

• Knowledge in electrical modeling (parasitic extraction under Cadence Xtract IM, Spice, Ansys).
• Experience in thermal simulations (Ansys Workbench, SolidWorks).
• Experience in system and sub‑system development.

Language Requirements

Good level of English (B2 minimum) and French (oral and written). Spanish is a plus.

Benefits

• Work on cutting‑edge technological projects with high impact.
• Innovation‑driven environment with access to the Grenoble ecosystem.
• Multiple development paths: technical expertise, project management, international within the Teledyne group.
• Structured onboarding program with a dedicated mentor.
• Flexible working environment including teleworking agreements and real work‑life balance.
• Commitment to QHSE/CSR goals (2025–2030) including a “40 by 40” carbon plan.
• Company culture of respect, integrity, responsibility, citizenship, and gender equality.
• Live in an Alpine environment combining technological excellence with a high quality of life.